Thermal Conductive Pad

Eco-friendly thermal pad with 5.0W/mK conductivity, UL recognized and RoHS compliant. Soft, self-adhesive design ensures excellent surface conformity and insulation. Ideal for LED displays, power modules, and EV batteries. Custom shapes available.

Ultra-soft thermal pad with 8.5W/m-K conductivity, ideal for delicate electronics and EV batteries. Naturally tacky, compressible, and available in custom shapes. UL V-0 rated, withstands -40 to 200°C. Reduces thermal resistance under low pressure.

Ultra-soft thermal interface material with 6.0W/m-K conductivity and 65 Shore 00 hardness. Protects sensitive components from mechanical stress. Self-adhesive, V-0 rated, customizable thickness and shapes. Ideal for medical, EV, and telecom applications.

High thermal conductivity 15W/mK with soft compressibility for low-stress applications. UL94 V-0, ROHS compliant. Custom shapes and thicknesses available. Ideal for 5G base stations, AI servers, and power electronics.

Ultra-soft silicone gap pad with 5.0W/mK thermal conductivity, ideal for AI processors and servers. Fills gaps under low pressure, electrically isolating, UL94 V-0 rated. Custom shapes and thicknesses available.

TIF100-50-11ES series thermal pad with 5.0W/mK conductivity and 10 Shore 00 hardness. Ultra-soft design eliminates air gaps under low pressure. Ideal for 5G, AI, EV, and aerospace. UL94 V-0, RoHS compliant. Custom shapes and thicknesses available.

Ultra-soft thermal gap pad with 4.0W/mK conductivity, ideal for stress-sensitive electronics. UL94 V-0 rated, customizable thickness 0.25-5.0mm. Naturally tacky, no adhesive needed. Suitable for CPUs, 5G, aerospace, and AI applications.

TIF200-15-27E series combines 1.5 W/mK thermal conductivity with ≥8000V/mm breakdown voltage. Soft, self-adhesive, and puncture-resistant. Ideal for power devices, EVs, and 5G. UL94 V-0 rated. Custom shapes and thicknesses available.

TIF 100-50-11U series ultra-soft thermal gap pad with 5.0 W/m-K conductivity and Shore 00 hardness as low as 27. Protects stress-sensitive components in AI servers and precision electronics. UL V-0 rated, custom shapes available.

TIF 100-50-10E ultra soft thermal pad offers 5.0 W/mK thermal conductivity and low thermal impedance. Shore OO 35/65 hardness ensures seamless gap filling. Ideal for cloud computing, servers, and 5G. UL V-0 rated. Custom shapes available.

Ultra-soft thermal gap pad with 10.0W/mK conductivity for AI servers. Self-adhesive, low-stress design protects delicate components. Custom shapes available. UL V-0 rated.

Ultra-soft 7.5W/mK thermal pad for AI processors and servers. Self-adhesive, low-stress fit for delicate components. Excellent insulation, V-0 rated. Custom shapes and thicknesses available.

High-performance 7.5W/mK thermal silicone gel pad for AI servers and processors. Super soft, self-adhesive, and electrically insulating. UL94 V-0 rated. Custom shapes and thicknesses available. Enhances heat dissipation and component lifespan.

Ultra-soft thermal pad with 5.0 W/mK conductivity, ideal for AI processors and sensitive electronics. Self-adhesive, ceramic-filled silicone offers low stress fit, high insulation, and UL V-0 rating. Custom thicknesses and shapes available.

Ultra-soft thermal pad with 5.0 W/mK conductivity, ideal for protecting sensitive components. Self-adhesive, electrically isolating, and UL94 V-0 rated. Custom thicknesses from 0.25mm to 5.0mm available. Suitable for CPUs, LEDs, and automotive electronics.

Ultra-soft thermal pad with 5.0 W/mK conductivity, ideal for protecting sensitive components. Self-adhesive, RoHS & UL compliant. Available in 0.25–5.0mm thickness. Custom shapes offered.

Ultra-soft thermal interface material with 4.0 W/m-K conductivity and 0.25-5.0mm thickness. Self-adhesive, high compliance, and V-0 flame rated. Ideal for protecting precision components in AI, LED, and telecom applications. Custom shapes available.

Ultra-soft thermal interface material with 4.0 W/m-K conductivity, 0.25-5.0mm thickness. Self-adhesive, electrically isolating, UL94 V-0 rated. Ideal for server racks, CPUs, and high-precision assemblies. Custom shapes available.

TIF500-30-11US ultra-soft thermal pad offers 3.0 W/m-K conductivity, high insulation, and self-adhesive design. Ideal for CPU, GPU, and EV batteries. UL recognized, RoHS compliant, and available in custom shapes.

Ultra-soft TIF500-30-11U gap filler pad with 3.0 W/m-K thermal conductivity and 65 Shore 00 hardness. Self-adhesive, electrically insulating, and UL 94 V-0 rated. Ideal for protecting sensitive components in power tools, EV batteries, and AI processors. Custom shapes and thicknesses available.