Thermal Conductive Pad

High-performance thermal pad with 8.5W/mK conductivity and 3mm thickness. Soft, compressible, electrically isolating, and UL recognized. Ideal for LED TV, power adapters, and memory modules. Custom die cuts and sizes available.

High-performance thermal pad with 8.5W/mK conductivity, soft and compressible for low-stress applications. Electrically isolating, UL94 V0 rated, and available in custom thicknesses. Ideal for LED, CPU, and power electronics cooling.

High thermal conductivity 8.5W/mK silicone pad for CPU, GPU, and laptop cooling. Soft, compressible, and electrically isolating. UL 94 V0 rated, RoHS compliant. Available in custom thicknesses and die-cut shapes for efficient heat dissipation.

High-performance thermal pad with 8.5W/mK conductivity and 1.5mm thickness. Fills air gaps between heat sources and sinks, enhancing component life. Soft, compressible, and electrically insulating. RoHS and UL94 V-0 compliant. Custom sizes and shapes available.

High-performance silicone thermal pad with 3.0W/mK conductivity, UL 94 V0 rated. Soft, compressible, and electrically isolating for custom heat dissipation in telecom, automotive, and battery systems. Available in 0.012-0.20in thickness with custom die-cut options.

TIF TM300 series thermal silicone pad offers 3.0W/mK conductivity, soft compressibility, and electrical isolation. Ideal for battery, PCB, and LED cooling. UL94 V-0, RoHS compliant. Custom thicknesses and shapes available.

High-performance thermal pad with 8.5W/mK conductivity, soft and compressible for low-stress applications. Naturally tacky, no adhesive needed. UL94 V-0 rated, available in thicknesses from 0.51mm to 5.08mm. Ideal for LED, GPU, and power modules.

High-performance thermal pad with 8.5W/m-K conductivity, soft and compressible for low-stress CPU cooling. Electrically isolating, RoHS compliant, UL94 V-0 rated. Custom sizes and shapes available for efficient heat management.

High-performance thermal gap pad with 8.5W/mK conductivity, 0.5mm thickness, and self-adhesive design. Fills gaps, insulates, and dampens vibration. Ideal for laptops, LEDs, and IT equipment. UL94 V0 rated, customizable thicknesses available.

High-performance 0.5mm thermal pad with 8.5W/mK conductivity. Soft, compressible, and electrically isolating for efficient heat transfer between CPUs, GPUs, and heatsinks. UL94 V-0 rated, durable, and customizable for industrial electronics.

High-performance thermal pad with 8.0W/mK conductivity, low oil permeability, and UL94V0 rating. Soft, compressible, and RoHS compliant. Ideal for PC, LED, and power supply cooling. Custom thicknesses available.

TIF7100QE silicone thermal pad offers 8.0 W/mK conductivity, low hardness, and high tack for minimal contact resistance. Ideal for CPUs, LEDs, and power electronics. UL94 V0 rated, customizable thicknesses, and free samples available.

TIF600P series gap filler pad offers 6.0W/mK thermal conductivity, excellent flexibility, and self-adhesive properties. Ideal for AI servers, inverters, and telecom devices. Available in custom shapes and thicknesses from 0.5mm to 5.0mm. UL V-0 rated.

TIF 600G series thermal pad offers 6.0W/mK conductivity, 60 Shore00 hardness, and 3.4 density. Self-adhesive, electrically isolating, and durable. Ideal for AI servers, CPUs, and power systems. Custom shapes available. UL V-0 rated.

High-performance 8W/mK silicone thermal pad fills gaps between heat sources and sinks. Soft, compressible, naturally tacky. UL94 V0 rated, RoHS compliant. Custom thickness and die-cut shapes available for efficient heat management.

TIF500-30-05U series ultra-soft thermal pad with 3.0 W/mK conductivity. Protects sensitive components from mechanical stress. Self-adhesive, good insulation, V-0 flame rating. Custom shapes and thicknesses available.

TIF100-30-23S silicone thermal pad offers 3.0 W/mK conductivity, 45-65 Shore 00 hardness, and V-0 fire rating. Self-adhesive, ceramic-filled, and customizable in thickness and shape. Ideal for 5G, aerospace, AI, and power electronics heat dissipation.

Ultra soft thermal pad with 3.2W/mK conductivity for stress-sensitive components. Self-adhesive, high insulation, UL V-0 rated. Ideal for AI servers, inverters, and EV batteries. Custom shapes available.

TIF 100-12-05US thermal pad offers 1.2W/mK conductivity, high dielectric strength, and UL V-0 flame rating. Soft, compressible, and naturally tacky for easy assembly. Custom shapes and thicknesses available. Ideal for IGBTs, LEDs, and power supplies.

Ultra-soft thermal pad with 2.6 W/mK conductivity and UL94 V-0 rating. Naturally tacky, low-stress fit for delicate components. Custom thicknesses and shapes available. Ideal for UAVs, LED, telecom, and medical devices.