Thermal Conductive Pad

TIF 100 2855-10 thermal pad offers 2.8W/mK conductivity, softness, and self-adhesion. Ideal for AI servers, CPUs, and LEDs. UL V-0 rated, custom shapes available. Reliable thermal transfer and insulation.

Ultra-soft thermally conductive gap pad with 4.0W/mK conductivity. Protects sensitive components from mechanical stress. Self-adhesive, good insulation, UL94 V-0 rated. Custom thicknesses and shapes available for AI servers and power electronics.

Low-density thermal pad with 1.5 W/mK conductivity and 45-65 Shore 00 hardness. Self-adhesive, good insulation, and V-0 fire rated. Ideal for power modules, LEDs, and AI servers. Custom shapes and thicknesses available.

Nickel/graphite-filled silicone pad with 4.5 W/mK thermal conductivity and surface resistivity

High-performance thermal pad with 1.2W/mK conductivity, soft and compressible for low-stress applications. Electrically isolating, naturally tacky, and available in multiple thicknesses. UL94 V-0 certified, ideal for CPUs, LEDs, and automotive electronics.

High-performance 5.0 W/mK thermal pad fills air gaps between heat sources and sinks. Soft, compressible, naturally tacky. Available in 0.25-5.00mm thickness. UL V-0 rated. Custom shapes and sizes offered. Ideal for CPUs, GPUs, LEDs, and power electronics.

High-performance thermal pad with 8.0W/mK conductivity, 1.5mm thickness, and soft compressibility for low-stress applications. UL94 V0 rated, ideal for filling gaps in LED, power supply, and memory modules. Custom sizes available.

High-performance 8.0W/m-K thermal pad with 1.0mm thickness, ceramic-filled silicone for efficient heat transfer. Soft, compressible, naturally tacky, and flame retardant (UL94 V0). Ideal for CPUs, GPUs, EV batteries, and LED cooling. Custom sizes and thicknesses available.

High-performance thermal pad with 8.5W/mK conductivity and 4.5mm thickness. Soft, compressible, and flame retardant (UL94 V0). Custom sizes available for LED, GPU, CPU, and SSD cooling. Reduces thermal resistance effectively.

High-performance thermal silicone pad with 8.5W/mK conductivity, low oil permeability, and high softness. Operates from -45°C to 200°C, UL94V0 rated. Ideal for LED, CPU, GPU, and power modules. Custom thicknesses and die-cut shapes available.

Ziitek TIFTM7140RUS silicone thermal pad offers 8.5W/mK conductivity, low hardness, and high tack for efficient heat transfer. UL recognized and RoHS compliant, it is ideal for cooling CPUs, memory modules, and LED components. Custom thicknesses available.

High-performance thermal pad with 8.5W/mK conductivity and 3mm thickness. Soft, compressible, electrically isolating, and UL recognized. Ideal for LED TV, power adapters, and memory modules. Custom die cuts and sizes available.

High-performance thermal pad with 8.5W/mK conductivity, soft and compressible for low-stress applications. Electrically isolating, UL94 V0 rated, and available in custom thicknesses. Ideal for LED, CPU, and power electronics cooling.

High thermal conductivity 8.5W/mK silicone pad for CPU, GPU, and laptop cooling. Soft, compressible, and electrically isolating. UL 94 V0 rated, RoHS compliant. Available in custom thicknesses and die-cut shapes for efficient heat dissipation.

High-performance thermal pad with 8.5W/mK conductivity and 1.5mm thickness. Fills air gaps between heat sources and sinks, enhancing component life. Soft, compressible, and electrically insulating. RoHS and UL94 V-0 compliant. Custom sizes and shapes available.

High-performance silicone thermal pad with 3.0W/mK conductivity, UL 94 V0 rated. Soft, compressible, and electrically isolating for custom heat dissipation in telecom, automotive, and battery systems. Available in 0.012-0.20in thickness with custom die-cut options.

TIF TM300 series thermal silicone pad offers 3.0W/mK conductivity, soft compressibility, and electrical isolation. Ideal for battery, PCB, and LED cooling. UL94 V-0, RoHS compliant. Custom thicknesses and shapes available.

High-performance thermal pad with 8.5W/mK conductivity, soft and compressible for low-stress applications. Naturally tacky, no adhesive needed. UL94 V-0 rated, available in thicknesses from 0.51mm to 5.08mm. Ideal for LED, GPU, and power modules.

High-performance thermal pad with 8.5W/m-K conductivity, soft and compressible for low-stress CPU cooling. Electrically isolating, RoHS compliant, UL94 V-0 rated. Custom sizes and shapes available for efficient heat management.

High-performance thermal gap pad with 8.5W/mK conductivity, 0.5mm thickness, and self-adhesive design. Fills gaps, insulates, and dampens vibration. Ideal for laptops, LEDs, and IT equipment. UL94 V0 rated, customizable thicknesses available.