Heat Sink Thermal Pad

Signal Communication Thermal Pad 1.5W 0.5mm~5.0mm Thickness Thermal Gap Filler Pad For New Energy Vehicle Signal Communication Thermal Pad 1.5W 0.5mm~5.0mm Thickness Thermal Gap Filler Pad For New Energy Vehicle Company Profile Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solutions and manufacturing superior thermal interface materials for competitive markets. Our extensive experience allows us to best assist customers in thermal

5.0W/mK Thermal Gap Filler Suitable For AI Processors And Electronic Devices Requiring Heat Transfer And Insulation TIF® 100-50-50S Series is a well-balanced, general-purpose thermal pad. It offers high thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use,making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components. It is an

RoHS Compliant 1.5W/M.K Cooling Gap Filler Insulation Silicone Pad Thermal Pad For New Energy Vehicle Ziitek TIF®100-10S Series is a well-balanced, general-purpose thermal pad offering good thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components. Key Features Good

Heat Sink Thermal Pad RoHS Compliant Silicone Insulation Pad With 1.5W/mK Thermal Conductivity For Cooling Applications TIF® 100-11S Series is a well-balanced, general-purpose thermal pad offering good thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components. Key

High-Voltage Silicone Thermal Pad Insulation Material Heat Conduction Sheet For Efficient Heat Transfer Company Profile With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others. Certifications:

High Conductive Insulation Thermal Silicone Pad Cooling Gap Filler Designed for semiconductor equipment, medical devices, and mask aligners, this thermal silicone pad offers exceptional thermal conductivity and insulation properties. Company Profile Ziitek is a leading manufacturer specializing in thermal interface materials including gap fillers, thermal insulators, conductive tapes, interface pads, thermal grease, and various silicone-based thermal solutions. Our company

Premium Soft Heat Sink Silicone Thermal Pad Low Thermal Resistance Thermal Gap Filler For Advanced Cooling Needs Products Discription TIF®100-65-11ES Series thermally conductive interface materials are applied to fillthe air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the heating elements or even

8.5W Silicone Thermal Conductive Pad Cooling LED CPU GPU Heat Conductivity Interface Materials Company Profile Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing

High Quality Thermal Pad Conductive Silicone Thermal Heating Pad Gpu Company Profile Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. Certifications: ISO9001:2015 ISO14001: 2004 IATF16949:2016 IECQ QC 080000:2017 UL TIF®7160RUS Series use a special process, with silicone as the

Battery Thermal Pad 8.5W/MKW 3.5 mm Thermal Insulator Silicone Pad Company Profile Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications. Certifications: ISO9001:2015 ISO14001: 2004 IATF16949:2016 IECQ QC 080000:2017 UL TIF®7140RUS Series

3.0W High Quality Factory Customized Thermal Pad Thermal Gap Filler Insulation Sheet Silicone Pad For LED CPU GPU MOS Company Profile Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well

High Performance 6.5W Heatsink Thermal Pads GPU CPU Cooling Conductive Silicone Thermal Pad Company Profile ZiitekZiitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. Certifications: ISO9001:2015 ISO14001: 2004 IATF16949:2016 IECQ QC 080000:2017 UL TIF®100 6520-11 series of thermal

High-performance thermal silicone pad with 3.0 W/mK conductivity and 5.0mm thickness designed for routers and electronic devices. Features high tack surface to reduce contact resistance, UL94V0 certification, and excellent moldability for complex components. Operates reliably from -40°C to 160°C with superior thermal management for automotive, IT, and consumer electronics applications.

Silicone-based thermal gap pad with 3.0 W/mK thermal conductivity and 4.5mm thickness. Features natural tackiness, electrical isolation, and excellent conformability for memory modules, motherboards, and power supplies. Available in multiple thicknesses with -40 to 160℃ operating range and >5500 VAC dielectric strength.

Ziitek TIF1160-30-06UF thermal pad offers 3.0 W/mK thermal conductivity and 4.0mm thickness for efficient heat dissipation in LED lighting applications. Features electrical isolation, vibration dampening, and custom die-cut options. Certified quality with free samples available for industrial and commercial use.

Professional 3.5mm thick electrically isolating conductive heat sink pads with 3.0 W/mK thermal conductivity. Ideal for display cards, automotive ECUs, and telecommunications hardware. Features high durability, UL certification, and excellent electrical insulation properties for reliable thermal management solutions.

High-performance thermal interface material featuring 3.0mm thickness and 3.0 W/mK thermal conductivity. This ceramic-filled silicone elastomer provides excellent heat dissipation for routers, LED systems, and electronic devices. RoHS compliant, UL recognized, and fiberglass reinforced for durability. Custom solutions available from experienced thermal engineering specialists.

High-performance 2.5mm thermal silicone pad with 3.0 W/mK thermal conductivity, UL94 V-0 certification, and operating range of -40°C to 160°C. Ideal for LED power supplies, AC-DC adapters, and electronic cooling applications. Features low thermal resistance, high compliance, and excellent moldability for complex components.

High-performance silicone thermal pad with 3.0 W/mK conductivity and 2.0mm thickness. Features low 75±5 Shore 00 hardness for excellent conformability, electrical isolation, and natural tackiness. Ideal for automotive electronics, IT infrastructure, and portable devices with temperature range from -40 to 160℃.

Customized Thermal Conductive Silicon Pad Thermal Conductive Silicone Thermal Heating Pad For Filling Gaps Company Profile Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape,