Thermal Gap Filler

Thermal Gap Filler Pads Low Volatility Silicone Material for Enhanced Thermal Conductivity in Electronic Components and Optical Devices Products description The TIF® 100L 3030-06 Series is an ultra-low silicon oxygen volatilization thermal pad designed specifically for the thermal management needs of optical and high-precision electronic devices.Balances efficient thermal conductivity and extremely low precipitation of condensable volatile substances, effectively avoiding

Custom Thermal Pad 2.0w/mk 0.25mm-5mm Thickness RoHS UL Certified Thermal Silicone Conductive Pads For LED Battery The TIF® 100-20-10F Series is a structurally supportive thermal pad designed to provide excellent heat dissipation while ensuring structural support and durability. It reliably fills interface gaps, transfers heat efficiently, and offers mechanical support for stacked components, resisting compressive deformation. This product is ideal for applications requiring

2.0W/mK Blue Thermal Conductive Pad Flexible Compressible Silicone For Low Stress Applications In Electronic Heat Dissipation Systems Company Profile Dongguan Ziitek Electronic Material and Technology Ltd. is a professional manufacturer of thermal interface materials with many years of industry experience. Integrating R&D, production, sales, and technical services, the company offers a comprehensive product line covering thermally conductive silicone pads, thermal conductive

Flexible Thermal Gap Filler Reinforced With Fiberglass For Thermal Management In LED TV And LED Lit Lamps Product Overview TIF® 100-18-02s Series is a well-balanced, general-purpose thermal pad offering good thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components. Key

High-performance thermal pad with 1.5W/mK conductivity, soft and compressible for low-stress applications. UL94 V-0 rated, electrically isolating, and durable from -45 to 200°C. Ideal for automotive, LED, and telecom cooling. Custom thickness and die-cut options available.

TIF100-06S series silicone gap pad offers 1.5W/mK thermal conductivity, low hardness, and electrical isolation. Soft, compressible, and high tack for optimal thermal performance. UL recognized and RoHS compliant. Custom thicknesses and die-cut shapes available.

Excellent Electrical Insulation High Thermal Conductivity 10W/mK Thermally Conductive Gap Filler Pads For Flat-panel Displays Product Overview TIF®100 10020-11 Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with an exceptionally gel-like softness, achieving a low-stress perfect fit. It is suitable for addressing issues in

High-performance ceramic-filled silicone thermal pad with 8.5W/mK conductivity. Naturally tacky, flexible, and UL94 V-0 rated. Ideal for filling air gaps in GPU, CPU, and LED assemblies. Custom thicknesses and shapes available. RoHS compliant.

Low Volatility Thermal Gap Filler Pads Product Overview The TIF® 100L 3040-06 Series is an ultra-low silicon oxygen volatilization thermal pad designed specifically for the thermal management needs of optical and high-precision electronic devices. This material balances efficient thermal conductivity with extremely low precipitation of condensable volatile substances, effectively avoiding pollution to sensitive optical components and precision circuits.The material features

TIF 100-16-38UF thermal gap filler with 1.6 W/mK conductivity fills air gaps for optimal heat transfer. Soft, compressible, naturally tacky, RoHS and UL compliant. Custom shapes and thicknesses available.

Ultra-soft ceramic-filled silicone pad with 6.5W/mK thermal conductivity. Low-stress fit protects sensitive components. Available in 0.25mm to 5mm thicknesses, custom shapes, and UL V-0 rated. Ideal for power modules, LEDs, and IT infrastructure.

TIF 200-02US Series thermal pad offers 1.5W/mK conductivity, soft conformability, and high insulation. Self-adhesive, puncture-resistant, and UL94 V-0 rated. Ideal for EV batteries, power electronics, and LED lighting. Custom shapes and thicknesses available.

General-purpose thermal pad with 2.0 W/m-K conductivity, Shore 00 hardness, and UL94 V-0 rating. Self-adhesive, ceramic-filled silicone elastomer enhances heat dissipation and extends component lifespan. Custom shapes and thicknesses available.

Ultra-low siloxane volatility prevents optical contamination. Soft, elastic ceramic-filled silicone ensures efficient heat transfer. Self-adhesive, highly compressible, and rated UL94 V-0. Ideal for embedded motherboards and precision electronics.

Naturally tacky 6.5W/mK thermal pad fills air gaps between heat sources and heatsinks. Soft, compressible, and moldable for low-stress applications. UL V-0 rated, available in custom shapes and thicknesses. Enhances device stability and lifespan.

Soft, compressible gap filler with 1.5W/mK thermal conductivity and ≥5500V/mm breakdown voltage. Naturally tacky, UL94 V-0 rated, and available in custom shapes. Ideal for optical modules, LED, and automotive electronics.

Ultra-soft 3.0 W/m-K thermal pad with 12 Shore 00 hardness ensures perfect contact under low pressure. Self-adhesive, V-0 flame rated, and electrically insulating. Ideal for 5G, AI, EV, and aerospace electronics. Custom shapes and thicknesses available.

TIF®500-30-11U thermal pad offers 3.0W/m-K conductivity, ultra-soft conformability, and self-adhesive design. Ideal for routers, LEDs, and power systems. UL94 V-0 rated, custom shapes available. Balances performance and cost effectively.

Ultra-soft thermal interface material with 2.8 W/m-K conductivity and 0.5mm thickness. Protects sensitive components, self-adhesive, good insulation. Ideal for EV batteries, LEDs, and electronics. Custom shapes available. UL94 V-0 rated.

Ultra soft thermal gap pad with 5.0 W/mK conductivity, designed for AI processors and servers. Protects sensitive components from mechanical stress. Self-adhesive, flexible, and available in custom thicknesses. UL V-0 rated.