Thermal Gap Filler
Low Volatility Thermal Gap Filler Silicone Pad 4.0W/mK for Automotive Electronics Heat Transfer
TIF 100L 4035-06 series thermal pad offers 4.0W/mK conductivity with low volatile silicone content. High flexibility fills uneven gaps, protecting components. Ideal for automotive, aerospace, and optical devices. Custom shapes available. UL V-0 rated.
TIF100-30-11US Thermal Gap Filler 3.0 W/mK Ultra-Soft Silicone Pad for Electronic Cooling
Ultra-soft thermal gap filler with 3.0 W/m-K conductivity and 20 Shore 00 hardness. Fiberglass reinforced, RoHS and UL V-0 rated. Ideal for sensitive electronics, EV batteries, and AI servers. Custom shapes and thicknesses available.
TIF100-20-10S Thermal Gap Filler Pad 2.0 W/m-K 0.25-5.00mm for Embedded Systems
General-purpose thermal pad with 2.0 W/m-K conductivity, Shore 00 hardness, and UL94 V-0 rating. Self-adhesive, ceramic-filled silicone elastomer enhances heat dissipation and extends component lifespan. Custom shapes and thicknesses available.
Low Volatility Thermal Gap Filler Pads Ensuring Thermal Management And Long Term Operation Stability In Electronic Devices
Low Volatility Thermal Gap Filler Pads Product Overview The TIF® 100L 3040-06 Series is an ultra-low silicon oxygen volatilization thermal pad designed specifically for the thermal management needs of optical and high-precision electronic devices. This material balances efficient thermal conductivity with extremely low precipitation of condensable volatile substances, effectively avoiding pollution to sensitive optical components and precision circuits.The material features
2.0W/mK Blue Thermal Conductive Pad Flexible Compressible Silicone For Low Stress Applications In Electronic Heat Dissipation Systems
2.0W/mK Blue Thermal Conductive Pad Flexible Compressible Silicone For Low Stress Applications In Electronic Heat Dissipation Systems Company Profile Dongguan Ziitek Electronic Material and Technology Ltd. is a professional manufacturer of thermal interface materials with many years of industry experience. Integrating R&D, production, sales, and technical services, the company offers a comprehensive product line covering thermally conductive silicone pads, thermal conductive
TIF 100-65-11US 6.5W/mK Thermal Gap Filler Pad for Precision Electronics 0.25mm-5mm
Ultra-soft ceramic-filled silicone pad with 6.5W/mK thermal conductivity. Low-stress fit protects sensitive components. Available in 0.25mm to 5mm thicknesses, custom shapes, and UL V-0 rated. Ideal for power modules, LEDs, and IT infrastructure.
Low Volatility Silicone Thermally Conductive Gap Filler Pad 2.0 W/mK for Embedded Motherboard
Ultra-low siloxane volatility prevents optical contamination. Soft, elastic ceramic-filled silicone ensures efficient heat transfer. Self-adhesive, highly compressible, and rated UL94 V-0. Ideal for embedded motherboards and precision electronics.
10W/mK Thermal Conductivity Excellent Electrical Insulation Thermally Conductive Gap Filler Pads For Flat-panel Displays
Excellent Electrical Insulation High Thermal Conductivity 10W/mK Thermally Conductive Gap Filler Pads For Flat-panel Displays Product Overview TIF®100 10020-11 Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with an exceptionally gel-like softness, achieving a low-stress perfect fit. It is suitable for addressing issues in
1.5W/mK Thermal Conductive Pad Soft Highly Conformable 0.25mm-5mm for EV Batteries
TIF 200-02US Series thermal pad offers 1.5W/mK conductivity, soft conformability, and high insulation. Self-adhesive, puncture-resistant, and UL94 V-0 rated. Ideal for EV batteries, power electronics, and LED lighting. Custom shapes and thicknesses available.
Soft 1.8W/mK Thermal Conductivity Gap Filler for EV Battery 0.25-5mm
Ultra-soft TIF100-18-56U gap filler with 1.8W/mK thermal conductivity, ideal for protecting sensitive EV battery components. Self-adhesive, V-0 flame rated, and available in custom shapes. Reliable thermal management for high-precision assemblies.
Thermal Pad 13.0W/mK High Thermal Conductive Silicone Pad for GPU CPU Heat Dissipation 0.75mm to 5.00mm
TIF 800QE series thermal pad offers 13.0W/mK conductivity, RoHS compliance, and UL94 V0 rating. Naturally tacky, electrically isolating, and available in thicknesses from 0.75mm to 5.00mm. Ideal for telecom, automotive, and LED applications. Custom shapes and sizes available.
5.0W Thermal Silicone Gap Pad 0.30mm-5.00mm for PCB Heat Dissipation
TS-TIF100C 5045-11 series silicone thermal pad fills gaps between heat sources and cooling plates. Features 5.0W/mK conductivity, self-adhesive, soft, and highly compressible. UL94 V0 rated. Custom thicknesses and die-cut shapes available for efficient thermal management.
TIF200-30-25S Thermal Silicone Pad 3.0 W/mK 0.25-5.00mm for Power Electronics
High-performance thermally conductive silicone pad with 3.0 W/mK conductivity, softness, and electrical insulation. Self-adhesive, puncture-resistant, and UL94 V-0 rated. Ideal for power devices, automotive, and consumer electronics. Custom shapes and thicknesses available.
5G Phone Battery Thermal Conductive Silicone Pad 0.5-5.0mm 2.6W/mK Gap Filler
Ultra-soft thermal pad with 2.6W/mK conductivity, ideal for protecting delicate components. Naturally tacky, compressible, and available in custom thicknesses. UL V-0 rated, suitable for batteries, LED, and power supplies.
3.5W Thermal Silicone Pad Gap Filler 0.5-5.0mm for CPU Heat Sink Insulation
High thermal conductivity of 3.5W/mK fills air gaps between heating elements and heat sinks. Naturally tacky, flexible, and available in 0.5-5.0mm thickness. Ideal for CPUs, automotive electronics, and LED lamps. UL94 V0 rated.
Silicone Thermal Pad 10.0W/mK High Temperature Heat Conductive Insulation 0.5-5mm
TIF 100C series silicone thermal pad offers 10.0W/mK conductivity, high compressibility, and self-adhesive surface for efficient heat transfer. Ideal for CPUs, LEDs, and power electronics. UL recognized, RoHS compliant, and available in custom die-cut shapes.
Thermal Gap Filler Pad 3.0 W/mK Soft Silicone Thermal Conductive Pad 0.25-5.00mm Thickness
TIF100-30-10S series thermal pad offers 3.0 W/mK conductivity and 65 Shore 00 softness for low-stress assembly. UL V-0 rated, naturally tacky, and customizable in thickness and shape. Ideal for power modules, EV batteries, and LED lighting.
Thermal Conductive Pad Silicone Material with 3.0W/mK Thermal Conductivity for Power Tools Heat Dissipation Applications
Thermal Conductive Pad Silicone Material with 3.0W/mK Thermal Conductivity for Power Tools Heat Dissipation Applications Company Profile Dongguan Ziitek Electronic Material and Technology Ltd. (ZIITEK ) has been deeply involved in the field of heat conducting materials for many years, and is a high-tech enterprise integrating R&D, production and sales. Headquartered in Dongguan, with four production bases in Kunshan, Taiwan Province and Viet Nam, the global delivery capacity
Customized Electrically Insulating Thermal Pad 1.5-16W/mK Heat Dissipation OEM Custom Size For GPU/CPU/LED
Customized Electrically Insulating Thermal Pad 1.5-16W/mK Heat Dissipation OEM Custom Size For GPU/CPU/LED Product Overview The TIF® 100-30-01UF Series is a structurally supportive thermal pad designed to provide high heat dissipation while ensuring structural support and durability. It reliably fills interface gaps, transfers heat, and offers mechanical support for stacked components, resisting compressive deformation. This product is ideal for applications requiring a
AI Server Thermal Pad Offering Excellent Thermal Conductivity And Electrical Insulation For Battery Pack Thermal Management
AI Server Thermal Pad Offering Excellent Thermal Conductivity And Electrical Insulation For Battery Pack Thermal Management Product Overview The TIF® 100-15-11UF Series is a structurally supportive thermal pad designed to provide high heat dissipation while also ensuring structural support and durability. It can reliably fill interface gaps, transfer heat, and offer mechanical support for stacked components, resisting compressive deformation. This product is an ideal choice