CPU Thermal Pad

45 Shore 00 thermally conductive silicone rubber 3.2W/M-K,Specific Gravity :3.0g/cc for IT infrastructure Company Profile Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. TIF500S Datasheet-REV02.pdf The TIF5180S is not only designed to take advantage of the gap heat transfer, to

45 Shore 00 silicone thermal pad 3.2W/M-K,Specific Gravity :3.0g/cc for mass storage devices Company Profile With professional R&D capabilities and over 13 year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation. TIF500S Datasheet-REV02.pdf The TIF5160S use a

45 Shore 00 thermal gap filler 3.2W/M-K,Specific Gravity :3.0g/cc For GPS navigation and other portable devices Company Profile Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. TIF500S Datasheet-REV02.pdf The TIF5140S is recommended for applications that require a minimum amount

China company supplied thermally conductive silicone rubber 3.2W/M-K,Continuos Use Temp: -40to 160℃ For notebook Company Profile Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field. We serve customers with customized products, full product lines and flexible

High Cost-Effectiv Silicone Sheet 2.5mmT 3.2W/M-K Electrically Isolating For Micro Heat Pipe Thermal Solutions high cost-effectiv silicone sheet 2.5mmT 3.2W/M-K electrically isolating For Micro heat pipe thermal solutions Company Profile Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step

Popular RoHS compliant 2.0mmT 3.2W/M-K Silicon Thermal Pad High durability For High speed mass storage drives Company Profile Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well

UL recognized 3.2 W/mK thermal conductive gap pad for heat pipe thermal solutions Company Profile Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. TIF500S Datasheet-REV02.pdf The TIF560S use a special process, with silicone as the base material, adding thermal conductive powder

China company supplied blue silicone sheets for GPS navigation and other portable device Company Profile Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications. TIF500S Datasheet-REV02.pdf The TIF540S is an extremely soft gap filling material

3.0W Ultra Soft Thermal Pad With Hardness 12 Shore00 High-Performance Silicone Gap Pads For Electronic Components Company Profile A silicone thermal pad is a type of thermal interface material (TIM) which is highly conductive and comprises of conformable materials which are used to provide a heat path between heat sinks and electronic devices where uneven surface topography, air gaps and texture preclude good thermal transfer. Ziitek supply a wide range of silicone thermal

Compressible blue silicone Thermal Pad High Conductivity Micro Heat Pipe Thermal Solutions Company Profile Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment

good performance CPU thermal pad TIF5200US with Violet color for various electronic device The TIF5200US is an electrically isolating material, which allows its use in applications requiring isolation between heat sinks and high-voltage, bare-leaded devices. TIF500US Datasheet -REV02.pdf Company Profile Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes,

High performance low cost CPU thermal pad TIF5160US with violet color for various electronic device The TIF5160US is an electrically isolating material, which allows its use in applications requiring isolation between heat sinks and high-voltage, bare-leaded devices. TIF500US Datasheet -REV02.pdf Company Profile Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this

High performance low cost CPU thermal pad TIF5140US with violet color for various electronic device Company Profile Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. The TIF5140US is an electrically isolating material, which allows its use in applications requiring isolation

High-performance violet thermal conductive pad with 2.6W/mK thermal conductivity and 3.0mm thickness. Features ceramic-filled silicone construction, -40°C to 160°C operating range, and UL 94 V0 fire rating. Ideal for display cards, CPUs, LED systems, and telecommunications hardware with comprehensive quality certifications.

High-performance 2.6W/mK thermal conductivity pad with 2.5mm thickness for efficient CPU and motherboard cooling. Features UL94 V-0 fire rating, broad hardness options, and easy installation. Certified with ISO9001, IATF16949, and IECQ QC 080000 standards for reliable thermal management solutions.

High-performance TIF580US thermal pad with 2.6W/mK conductivity and 2.0mm thickness for efficient CPU and motherboard cooling. Features ceramic-filled silicone construction, UL 94 V0 fire rating, and comprehensive quality certifications including ISO9001:2015. Ideal for electronics requiring reliable thermal management solutions.

High-performance thermal pad with 2.6W/mK conductivity and 1.5mm thickness for efficient CPU and motherboard cooling. Features ceramic-filled silicone construction, UL 94 V0 fire rating, and multiple international certifications including ISO9001 and IATF16949. Ideal for electronics requiring reliable thermal management.

High-performance thermal pad with 2.6W/mK conductivity and 1.0mm thickness designed for motherboard and CPU cooling. Features UL 94 V0 fire rating, broad hardness options, and easy installation. Certified with ISO9001, IATF16949, and IECQ standards for reliable thermal management in electronic devices.

High-performance TIF500 thermal pad with 2.6 W/mK thermal conductivity and electrical isolation properties. Available in thicknesses from 0.5mm to 5.0mm, this violet ceramic-filled silicone rubber material provides excellent heat management for electronic devices including portable electronics, storage devices, and audio/video components.

High-performance TIF500S thermal pad with 3.2 W/mK conductivity and electrical isolation properties. Ideal for CPU cooling, portable electronics, and storage devices. Available in thicknesses from 0.25mm to 5.08mm with pressure-sensitive adhesive options. Operating range -40°C to 160°C with >5500 VAC dielectric strength.