Company Profile
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HongRuiXing (Hubei) Electronics Co.,Ltd.
HOREXS is a famous Chinese IC substrate manufacturer which professionally produce 2-6L substrate (buildup types) exceeded 10 years.
Main Products
BGA Substrate, IC Package Substrate
Annual Sales
50million-100million
Employees
100~200
Location
China
Featured Products
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Categories
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BGA Substrate
25 products
BT FR4 NAND Memory Substrate Board 35/35μm 4-Layer ENEPIG for DRAM/SSD/LPDDR Packaging
Microelectronics Package Substrate Manufacturing - 1-6 Layers, 0.18mm Thickness, 25μm Line Width for IC & Semiconductor Packaging
BGA Memory Substrate with ENEPIG ENIG Surface Finish - 1 mil Line Width, 0.1-0.4mm BT Thickness
BT Material Semiconductor Package Substrate L/S 35/35μm - 0.1-0.4mm Thickness with 20μm Line/Space Capability
IC Package Substrate
47 products
eMMC IC Package Substrate PCB - 0.2mm FR4 BGA with 1mil Line Width for Semiconductor Assembly
4-Layer BT Material IC Substrate - 25μm Line Width, 0.22mm Thickness for Semiconductor Packaging
0.2mm 2-Layer Memory Card Substrate for IC Encapsulation - 25μm Line Width, 0.29mm Thickness
Hitachi BT IC Package Substrate 0.29mm Thickness 25μm Line Width for Memory Electronics Manufacturing
Sip Package Substrate
3 products
4-Layer SiP Package Substrate with 25μm Line Width and 0.22mm Thickness for Heterogeneous System Integration
IC Substrate Manufacturing - 1-6 Layer Build-Up with 25μm Line Width & 0.24mm Thickness for Wearable Electronics
4-Layer IC Substrate BT Material with 25μm Line Width and 0.22mm Thickness for Semiconductor Packaging
FCCSP Package Substrate
8 products
BT FCCSP Package Substrate 3x3mm 0.3mm Thickness 25µm Line Width For Flip Chip Assembly
FCCSP IC Substrate Manufacturing - 0.4mm Thickness, 25μm Line Width, 600K SQM Annual Capacity
FCCSP/FCBOC Package Substrate for PC/Server DRAM & SRAM/LPDDR - 0.25mm Thickness, 1-6 Layers
Flip Chip CSP Package Substrate 5x5mm Green BT Material 0.3mm Thickness 25μm Line Width
Sensors Substrate
3 products
RF Module Substrate
2 products
Memory Substrate
21 products
4-Layer MicroSD Card IC Substrate PCB - 0.2mm Thickness, 10/10μm Line/Space, 600,000 SQM Annual Capacity
Custom Black Memory IC Substrate for Memory Cards - 0.18mm Thickness, 12μm Copper, 2 Layer Design
0.15mm Gold Finger SD Card IC Substrate PCB - 10/10μm Line Width, 0.2mm Thickness for Memory Electronics
IC Substrate PCB Manufacturing - 10/10μm Line Width, 0.26mm Thickness, 600,000 SQM Annual Capacity
MEMS Substrate
3 products
OEM ODM BT Material MEMS/CMOS Substrate 1-6 Layer 0.1-0.4mm Thickness Multilayer Manufacturing
0.2mm Ultrathin MEMS Packaging Substrate for Microphones - 0.1-0.4mm Thickness, 1-6 Layers Customizable
Ultra-Thin MEMS Package Substrate 0.1-0.4mm Thickness with 25μm Line Width for Semiconductor Manufacturing
All Products
View our complete catalog of high-quality products.
FR4 Memory IC Substrate 0.24mm Thickness with 10/10μm Line Width for Semiconductor Packaging
Price: US 0.089-0.109 each piece
MOQ: 1000pieces
BT FR4 NAND Memory Substrate Board 35/35μm 4-Layer ENEPIG for DRAM/SSD/LPDDR Packaging
Price: US 120-150 per square meter
MOQ: 1 square meter
0.1mm to 0.4mm Ultra-Thin PCB with 25μm Line Width and 50μm Line Space for Electronics
Price: US 0.11-0.13 each piece
MOQ: 1 square meter
IC Substrate Manufacturing - 1-6 Layer Custom Boards with 25μm Line Width & 0.28mm Thickness
Price: US 95-120 per square meter
MOQ: 1 square meter
0.12mm Ultra-Thin Rigid PCB with 10/10μm Line Width & 12μm Copper - 2 Layer FR4 Circuit Board
Price: US 120-150 per square meter
MOQ: 100pieces
Microelectronics Package Substrate Manufacturing - 1-6 Layers, 0.18mm Thickness, 25μm Line Width for IC & Semiconductor Packaging
Price: US 120-150 per square meter
MOQ: 1 square meter
4-Layer MicroSD Card IC Substrate PCB - 0.2mm Thickness, 10/10μm Line/Space, 600,000 SQM Annual Capacity
Price: US 120-150 per square meter
MOQ: 1 square meter
Custom Ultrathin Rigid PCB Fabrication with 25μm Line Width and 0.1-0.4mm Thickness for IC Substrate Applications
Price: US 120-150 per square meter
MOQ: 1 square meter
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